People are constantly seeking to develop more, lighter and smaller products with lower cost and less time, which makes the design process of electronic products face unprecedented challenges. To address these challenges, designers combine chips and circuit boards in a new structure, such as complex 3D stacking structures, or new packaging technologies such as package stacking (PoP) and system-level packaging (SiP). They also embed passive components and active components into the inner layer, inner cavity and medium of the printed circuit board.

Traditional 2D PCB design systems are used to design a circuit board at a time, isolating it from other PCBs in the same product, and also isolating it from IC, packaging, and enclosures. Verifying the connections between PCBs, checking for conflicts between PCBs and enclosures, and reducing the distance to IC require manual operation, which is time-consuming and error-prone and limits the possibility of reuse.

People are constantly seeking to develop more, lighter and smaller products with lower cost and less time, which makes the design process of electronic products face unprecedented challenges. To address these challenges, designers combine chips and circuit boards in a new structure, such as complex 3D stacking structures, or new packaging technologies such as package stacking (PoP) and system-level packaging (SiP). They also embed passive components and active components into the inner layer, inner cavity and medium of the printed circuit board.

People are constantly seeking to develop more, lighter and smaller products with lower cost and less time, which makes the design process of electronic products face unprecedented challenges. To address these challenges, designers combine chips and circuit boards in a new structure, such as complex 3D stacking structures, or new packaging technologies such as package stacking (PoP) and system-level packaging (SiP). They also embed passive components and active components into the inner layer, inner cavity and medium of the printed circuit board.

People are constantly seeking to develop more, lighter and smaller products with lower cost and less time, which makes the design process of electronic products face unprecedented challenges. To address these challenges, designers combine chips and circuit boards in a new structure, such as complex 3D stacking structures, or new packaging technologies such as package stacking (PoP) and system-level packaging (SiP). They also embed passive components and active components into the inner layer, inner cavity and medium of the printed circuit board.

Traditional 2D PCB design systems are used to design a circuit board at a time, isolating it from other PCBs in the same product, and also isolating it from IC, packaging, and enclosures. Verifying the connections between PCBs, checking for conflicts between PCBs and enclosures, and reducing the distance to IC require manual operation, which is time-consuming and error-prone and limits the possibility of reuse.